TGVTECH.TGVTECH was established on June 17, 2022, with its registered location in Tianmen City, Hubei Province. TGVTECH primarily engages in the R&D and manufacturing of glass-based TGV multilayer precision circuit boards, as well as packaging technologies and products for related application fields. Its products hold broad application prospects in advanced semiconductor packaging substrates for 2.5D/3D chiplets, high-performance computing (AI, supercomputers, data centers), sensing (MEMS, biosensing devices), RF components for 6G communications and low-Earth orbit satellite antennas, as well as CPO optoelectronic co-packaging for optical communications. Since its inception, TGVTECH has become the world's earliest company to industrialize TGV glass-based multilayer circuit boards and remains one of the few globally possessing full-process manufacturing capabilities and equipment for TGV multilayer circuit boards. From glass thinning, via drilling, via filling, and metallization, to glass coating, photolithography, and cutting, as well as the development of laminated materials and RDL multi-layer laminated circuit fabrication, Tongge Micro possesses comprehensive technological integration advantages across the entire industrial chain. The company has established extensive and in-depth collaborations with numerous renowned domestic and international clients, with some projects already entering mass production. TGVTECH will continue to increase investment in R&D innovation, deepen its expertise in novel semiconductor materials, and strive to become a world-leading provider in glass-based precision circuit boards and their applications. Key products include: glass-based chip packaging substrates, CPO applications & RF devices, light-emitting chip packaging substrates, and microfluidics.
